MB85RC64TAPNF-G-BDERE1

Fujitsu Electronics America, Inc. MB85RC64TAPNF-G-BDERE1

Part No:

MB85RC64TAPNF-G-BDERE1

Package:

8-SOIC (0.154, 3.90mm Width)

AINNX NO:

9497132-MB85RC64TAPNF-G-BDERE1

Category:

Memory

Description:

IC FRAM 64K I2C 3.4MHZ 8SOP

Products specifications
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154, 3.90mm Width)
  • Supplier Device Package
    8-SOP
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Voltage - Supply
    1.8V~3.6V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    64Kb 8K x 8
  • Clock Frequency
    3.4MHz
  • Access Time
    130ns
  • Memory Format
    FRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    I2C
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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