Fujitsu Electronics America, Inc. FCN-568Z008-G/0M

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.31.00.01

Automotive

No

PPAP

No

Terminal Pitch (mm)

1.1

Termination Method

Solder

Body Orientation

Right Angle

Maximum Current Rating (A)

0.5

Maximum Voltage Rating

5VAC|5VDC

Maximum Contact Resistance (mOhm)

100

Minimum Operating Temperature (°C)

-20

Maximum Operating Temperature (°C)

70

Mating Cycle (Cycles)

10000

PCB Mounting Side

Normal

Product Depth (mm)

15.12

Mounting

Surface Mount

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Micro SD Card

Number of Rows

1

Gender

F

Number of Contacts

8

Product Length (mm)

14.55

Product Height (mm)

1.65