UMFT4222PROG-IC-B

FTDI, Future Technology Devices International Ltd UMFT4222PROG-IC-B

Part No:

UMFT4222PROG-IC-B

Package:

-

AINNX NO:

7749902-UMFT4222PROG-IC-B

Description:

MODULE PROGR BRIDGE DEV FT4222H

Products specifications
  • Factory Lead Time
    19 Weeks
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Published
    2015
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Type
    Programmer
  • Contents
    Board(s)
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