FTDI, Future Technology Devices International Ltd MORPH-IC-II

Factory Lead Time

19 Weeks

Package / Case

Module

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Published

2006

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

FPGA

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

85°C

Min Operating Temperature

0°C

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

3.3V

Interface

Serial, USB

Evaluation Kit

Yes

Contents

Board(s)

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free