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FTDI DLP-TEMP-G
Part No:
DLP-TEMP-G
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
31333349-DLP-TEMP-G
Category:
Description:
Datalogging & Acquisition DLP Module
Products specifications
- RoHSDetails
- Factory Pack QuantityFactory Pack Quantity1
- PackageBulk
- MfrFTDI, Future Technology Devices International Ltd
- Product StatusActive
- For Use With/Related ProductsUSB
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Bulk - SeriesDLP-TEMP
- TypeDAQ
- Accessory TypeModule Data Acquisition
- Specifications
a measure of a material's ability to?conduct heat.?
3-Digital I/Os, 3-Analog Inputs - ProductThermostats
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Pricing & Ordering
Quantity
Unit Price
Ext. Price
1+
$1,734.366154
$1,734.38
10+
$1,636.194507
$16,361.90
100+
$1,543.579675
$154,357.93
500+
$1,456.207236
$728,103.61
1000+
$1,373.780397
$1,373,780.41
* The above prices does not include taxes and freight rates, which will be calculated on the order pages.