FTDI DLP-TEMP-G

Part No:

DLP-TEMP-G

Manufacturer:

FTDI

Datasheet:

Package:

AINNX NO:

31333349-DLP-TEMP-G

Category:

Interface Boards

Description:

Datalogging & Acquisition DLP Module

Products specifications

RoHS
Details
Factory Pack QuantityFactory Pack Quantity
1
Package
Bulk
Mfr
FTDI, Future Technology Devices International Ltd
Product Status
Active
For Use With/Related Products
USB
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Bulk
Series
DLP-TEMP
Type
DAQ
Accessory Type
Module Data Acquisition
Specifications
a measure of a material's ability to?conduct heat.?
3-Digital I/Os, 3-Analog Inputs
Product
Thermostats

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