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Home /Integrated Circuits (ICs) /Linear - Amplifiers - Special Purpose /TZA3044T/C2,112 /
TZA3044T/C2,112

Freescale Semiconductor, Inc. (NXP Semiconductors) TZA3044T/C2,112

Part No:

TZA3044T/C2,112

Datasheet:

-

Package:

-

AINNX NO:

31799633-TZA3044T/C2,112

Description:

Products specifications
  • EU RoHS
    Compliant
  • Automotive
    No
  • PPAP
    No
  • Mounting
    Surface Mount
  • Package Height
    1.45(Max)
  • Package Width
    4(Max)
  • Package Length
    10(Max)
  • PCB changed
    16
  • Standard Package Name
    SOP
  • Supplier Package
    SO
  • Lead Shape
    Gull-wing
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Pin Count

    a count of all of the component leads (or pins)

    16
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