TEF7016HN/V101,557

Freescale Semiconductor, Inc. (NXP Semiconductors) TEF7016HN/V101,557

Part No:

TEF7016HN/V101,557

Datasheet:

-

Package:

-

AINNX NO:

32035355-TEF7016HN/V101,557

Description:

Products specifications
  • EU RoHS
    Supplier Unconfirmed
  • ECCN (US)
    EAR99
  • Automotive
    Yes
  • PPAP
    Yes
  • Category
    Receiver Module
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Mounting
    Surface Mount
  • Package Height
    0.85 - 0.05(Max)
  • Package Width
    5.1(Max)
  • Package Length
    5.1(Max)
  • PCB changed
    32
  • Standard Package Name
    QFN
  • Supplier Package
    HVQFN EP
  • Lead Shape
    No Lead
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Pin Count

    a count of all of the component leads (or pins)

    32
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