TEA19162HT/2J

Freescale Semiconductor, Inc. (NXP Semiconductors) TEA19162HT/2J

Part No:

TEA19162HT/2J

Datasheet:

-

Package:

-

AINNX NO:

31979132-TEA19162HT/2J

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Operation Mode
    DCM
  • Minimum Operating Supply Voltage (V)
    -0.4
  • Maximum Operating Supply Voltage (V)
    38
  • UVLO Turn-On Threshold (V)
    9
  • Switching Frequency (kHz)
    402
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    150
  • Mounting
    Surface Mount
  • Package Height
    1.45(Max)
  • Package Width
    4(Max)
  • Package Length
    5(Max)
  • PCB changed
    8
  • Standard Package Name
    SOP
  • Supplier Package
    SO
  • Lead Shape
    Gull-wing
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Power Factor Correction Controller
  • Pin Count

    a count of all of the component leads (or pins)

    8
  • Topology
    Boost
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