Freescale Semiconductor, Inc. (NXP Semiconductors) SPK8103M1200F

EU RoHS

Not Compliant

ECCN (US)

3A991

SVHC

Yes

SVHC Exceeds Threshold

Yes

Automotive

No

PPAP

No

Device Million Instructions per Second (MIPS)

300

Programmability

No

Device Input Clock Speed (MHz)

300

Minimum Operating Supply Voltage (V)

1.55|3.135

Typical Operating Supply Voltage (V)

1.6|3.3

Maximum Operating Supply Voltage (V)

1.7|3.465

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

75

Mounting

Surface Mount

Package Height

2.68(Max)

Package Width

17

Package Length

17

PCB changed

332

Standard Package Name

BGA

Supplier Package

FCBGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Each

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

332

RAM Size

512KB

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

ROMLess