SJA1124BHG/0Z

Freescale Semiconductor, Inc. (NXP Semiconductors) SJA1124BHG/0Z

Part No:

SJA1124BHG/0Z

Datasheet:

-

Package:

-

AINNX NO:

31963246-SJA1124BHG/0Z

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    5A991
  • HTS
    8542330001
  • Automotive
    Yes
  • PPAP
    Yes
  • LIN Specifications
    LIN 2.0|LIN 2.1|LIN 2.2|LIN 2.2A
  • LIN Bus Wake-up Capable
    Yes
  • External Wake-up Pin
    Yes
  • Maximum Data Rate (kBd)
    20
  • Minimum Single Supply Voltage (V)
    5
  • Maximum Single Supply Voltage (V)
    28
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    150
  • Mounting
    Surface Mount
  • Package Height
    0.95(Max)
  • Package Width
    3.6(Max)
  • Package Length
    5.6(Max)
  • PCB changed
    24
  • Supplier Package
    DHVQFN EP
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Pin Count

    a count of all of the component leads (or pins)

    24
  • Power Supply Type

    There are three major kinds of power supplies: unregulated (also called brute force), linear regulated, and switching. The fourth type of power supply circuit called the ripple-regulated, is a hybrid between the “brute force” and “switching” designs, and merits a subsection to itself.

    Single
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