PESD5V0V1BB,315

Freescale Semiconductor, Inc. (NXP Semiconductors) PESD5V0V1BB,315

Part No:

PESD5V0V1BB,315

Datasheet:

-

Package:

-

AINNX NO:

31953776-PESD5V0V1BB,315

Description:

Products specifications
  • EU RoHS
    Supplier Unconfirmed
  • ECCN (US)
    EAR99
  • Automotive
    Yes
  • PPAP
    Unknown
  • Direction Type
    Bi-Directional
  • Number of Elements per Chip
    1
  • Maximum Working Voltage (V)
    5
  • Maximum Clamping Voltage (V)
    12.5
  • Maximum Leakage Current (uA)
    0.01
  • Capacitance Value (pF)
    13
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Supplier Temperature Grade
    Automotive
  • Mounting
    Surface Mount
  • Package Height
    0.65(Max)
  • Package Width
    0.85(Max)
  • Package Length
    1.25(Max)
  • PCB changed
    2
  • Standard Package Name
    SC
  • Supplier Package
    SC-79
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Unconfirmed
  • Type
    TVS
  • Pin Count

    a count of all of the component leads (or pins)

    2
  • Configuration
    Single
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