PEGLT2PL-DEV

Freescale Semiconductor, Inc. (NXP Semiconductors) PEGLT2PL-DEV

Part No:

PEGLT2PL-DEV

Datasheet:

-

Package:

-

AINNX NO:

32002038-PEGLT2PL-DEV

Description:

Products specifications
  • ECCN (US)
    3D991
  • Automotive
    Unknown
  • PPAP
    Yes
  • Supported Device
    ColdFire/Kinetis/i.MX
  • Supported Device Technology
    Application Processor and SOC/Microcontroller
  • Operating Systems
    Linux|RTOS|Win
  • Supported Programming Language
    C++
  • Available Upgrade
    No
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Each
  • Type
    Run-time
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