Freescale Semiconductor, Inc. (NXP Semiconductors) MMA6361LR2

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

14

Package Description

TFBGA, LGA14,3X6,31

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

LGA14,3X6,31

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

MMA6361LR2

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

TFBGA

Package Shape

RECTANGULAR

Manufacturer

NXP Semiconductors

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.59

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

unknown

JESD-30 Code

R-PBGA-N14

Supply Voltage-Max (Vsup)

3.6 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

2.2 V

Number of Channels

1

Analog IC - Other Type

ANALOG CIRCUIT

Seated Height-Max

1.05 mm

Width

3 mm

Length

5 mm