Freescale Semiconductor, Inc. (NXP Semiconductors) MF1SPLUS6011DA4/03

EU RoHS

Compliant

ECCN (US)

5A992

Automotive

Unknown

PPAP

Yes

Standard Supported

ISO/IEC 14443-3

Maximum Supply Current (mA)

30

Maximum Power Dissipation (mW)

200

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

70

Mounting

Surface Mount

Package Height

0.33(Max)

Package Length

35.05(Max)

Standard Package Name

PLLMC

Supplier Package

PLLMC

Lead Shape

No Lead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete