MC56F8323VFB60
LQFP
15285269-MC56F8323VFB60
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
The center distance from one pole to the next.
a count of all of the component leads (or pins)
An indicator of formal certification of qualifications.
The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
The memory capacity is the amount of data a device can store at any given time in its memory.
Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.