MC44BC373DTBR2

Freescale Semiconductor, Inc. (NXP Semiconductors) MC44BC373DTBR2

Part No:

MC44BC373DTBR2

Datasheet:

-

Package:

-

AINNX NO:

32031726-MC44BC373DTBR2

Description:

Products specifications
  • EU RoHS
    Not Compliant
  • ECCN (US)
    EAR99
  • SVHC
    Yes
  • SVHC Exceeds Threshold
    Yes
  • Automotive
    No
  • PPAP
    No
  • Mounting
    Surface Mount
  • Package Height
    1.05(Max)
  • Package Width
    4.5
  • Package Length
    7.9(Max)
  • PCB changed
    24
  • Standard Package Name
    SOP
  • Supplier Package
    TSSOP
  • Lead Shape
    Gull-wing
  • Package Description
    ,
  • Manufacturer Part Number
    MC44BC373DTBR2
  • Manufacturer
    NXP Semiconductors
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    NXP SEMICONDUCTORS
  • Risk Rank
    5.58
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Reach Compliance Code
    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    24
  • Consumer IC Type
    CONSUMER CIRCUIT
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