Freescale Semiconductor, Inc. (NXP Semiconductors) 74LVC541ABQ-Q100X

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.39.00.01

Automotive

Yes

PPAP

Unknown

Logic Family

LVC

Number of Elements per Chip

1

Number of Channels per Chip

8

Number of Inputs per Chip

8

Number of Input Enables per Chip

0

Number of Outputs per Chip

8

Number of Output Enables per Chip

2 Low

Bus Hold

No

Maximum Propagation Delay Time @ Maximum CL (ns)

3.5(Typ)@2.7V|2.9(Typ)@3.3V

Absolute Propagation Delay Time (ns)

18.5

Process Technology

CMOS

Input Signal Type

Single-Ended

Maximum Low Level Output Current (mA)

24

Maximum High Level Output Current (mA)

-24

Minimum Operating Supply Voltage (V)

1.2

Typical Operating Supply Voltage (V)

1.8|2.5|3.3

Maximum Operating Supply Voltage (V)

3.6

Tolerant I/Os (V)

5

Typical Quiescent Current (uA)

0.1

Maximum Quiescent Current (uA)

40

Propagation Delay Test Condition (pF)

50

Maximum Power Dissipation (mW)

500

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Mounting

Surface Mount

Package Height

0.88

Package Width

2.5

Package Length

4.5

PCB changed

20

Standard Package Name

QFN

Supplier Package

DHVQFN EP

Lead Shape

No Lead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

20

Output Type

3-State

Polarity

Non-Inverting

Logic Function

Buffer/Line Driver