Freescale Semiconductor, Inc. (NXP Semiconductors) 74LVC162245ADGG,512

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Logic Family

LVC

Data Flow Direction

Bi-Directional

Number of Elements per Chip

2

Number of Channels per Chip

16

Number of Selection Inputs per Element

0

Number of Output Enables per Element

1 Low

Number of Input Enables per Element

0

Number of Direction Control Inputs

1 Low/High

Bus Hold

No

Absolute Propagation Delay Time (ns)

19.8

Maximum Propagation Delay Time @ Maximum CL (ns)

3.5(Typ)@2.7V|2.9(Typ)@3.3V

Propagation Delay Test Condition (pF)

50

Process Technology

CMOS

Input Level

LVTTL

Maximum Low Level Output Current (mA)

12

Maximum High Level Output Current (mA)

-12

Typical Quiescent Current (uA)

0.1

Maximum Quiescent Current (uA)

80

Minimum Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

3.6

Tolerant I/Os (V)

5

Maximum Power Dissipation (mW)

500

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Mounting

Surface Mount

Package Height

1.05(Max)

Package Width

6.2(Max)

Package Length

12.6(Max)

PCB changed

48

Supplier Package

TSSOP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Pin Count

a count of all of the component leads (or pins)

48

Output Type

3-State

Polarity

Non-Inverting

Logic Function

Bus Transceiver

Output Level

LVTTL