Freescale Semiconductor, Inc. (NXP Semiconductors) 74CBTLV3126PW,118

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.39.00.01

Automotive

No

PPAP

No

Logic Family

CBTLV

Number of Elements per Chip

4

Number of Inputs per Chip

4

Number of Outputs per Chip

4

Absolute Propagation Delay Time (ns)

6.5

Process Technology

CMOS

Maximum Propagation Delay Time @ Maximum CL (ns)

0.31@3V to 3.6V

Maximum On Resistance (Ohm)

8.4(Typ)

Maximum High Level Output Current (mA)

-128

Maximum Low Level Output Current (mA)

128

Minimum Operating Supply Voltage (V)

2.3

Typical Operating Supply Voltage (V)

2.5|3.3

Maximum Operating Supply Voltage (V)

3.6

Maximum Quiescent Current (uA)

50

Propagation Delay Test Condition (pF)

50

Maximum Power Dissipation (mW)

500

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Mounting

Surface Mount

Package Height

0.95(Max)

Package Width

4.5(Max)

Package Length

5.1(Max)

PCB changed

14

Supplier Package

TSSOP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

14

Configuration

1 x 1:1

Logic Function

Bus Switch