Freescale Semiconductor, Inc. (NXP Semiconductors) 74AVC16T245DGV-Q1J

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

Yes

PPAP

Unknown

Logic Family

AVC

Maximum Propagation Delay Time @ Maximum CL (ns)

14.4(Typ)@0.8V

Absolute Propagation Delay Time (ns)

22.2

Process Technology

CMOS

Maximum Low Level Output Current (mA)

12

Maximum High Level Output Current (mA)

-12

Minimum Operating Supply Voltage (V)

0.8

Typical Operating Supply Voltage (V)

1.8|2.5|3.3

Maximum Operating Supply Voltage (V)

3.6

Maximum Quiescent Current (mA)

0.185

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Mounting

Surface Mount

Package Height

0.95(Max)

Package Width

4.5(Max)

Package Length

9.8(Max)

PCB changed

48

Supplier Package

TSSOP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

48

Output Type

3-State

Number of Channels

16

Logic Function

Voltage Level Translator

Channel Type

Bidirectional