EU RoHS
Compliant
ECCN (US)
EAR99
HTS
8542.39.00.01
Automotive
Yes
PPAP
Unknown
Logic Family
AHC
Number of Channels per Chip
8
Number of Elements per Chip
1
Number of Element Inputs
8
Number of Element Outputs
8
Bus Hold
No
Set/Reset
Master Reset
Triggering Type
Positive-Edge
Maximum Propagation Delay Time @ Maximum CL (ns)
Absolute Propagation Delay Time (ns)
21.5
Process Technology
CMOS
Input Signal Type
Single-Ended
Maximum Low Level Output Current (mA)
8
Maximum High Level Output Current (mA)
-8
Minimum Operating Supply Voltage (V)
2
Typical Operating Supply Voltage (V)
5
Maximum Operating Supply Voltage (V)
5.5
Maximum Quiescent Current (mA)
0.004
Propagation Delay Test Condition (pF)
50
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
125
Supplier Temperature Grade
Automotive
Mounting
Surface Mount
Package Height
0.95(Max)
Package Width
4.5(Max)
Package Length
6.6(Max)
PCB changed
20
Supplier Package
TSSOP
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape and Reel
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active
Pin Count
a count of all of the component leads (or pins)
20
Polarity
Non-Inverting
Logic Function
D-Type Bus Interface