Freescale Semiconductor, Inc. (NXP Semiconductors) 74ABT162245ADGG:11

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.39.00.01

Automotive

No

PPAP

No

Logic Family

ABT

Data Flow Direction

Bi-Directional

Number of Elements per Chip

2

Number of Channels per Chip

16

Number of Selection Inputs per Element

0

Number of Output Enables per Element

1 Low

Number of Input Enables per Element

0

Number of Direction Control Inputs

1 Low/High

Bus Hold

No

Absolute Propagation Delay Time (ns)

7

Maximum Propagation Delay Time @ Maximum CL (ns)

4.5@5V

Propagation Delay Test Condition (pF)

50

Process Technology

BiCMOS

Input Level

TTL

Maximum Low Level Output Current (mA)

12

Maximum High Level Output Current (mA)

-32

Typical Quiescent Current (uA)

10000

Maximum Quiescent Current (uA)

19000

Minimum Operating Supply Voltage (V)

4.5

Maximum Operating Supply Voltage (V)

5.5

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Mounting

Surface Mount

Package Height

1.05(Max)

Package Width

6.2(Max)

Package Length

12.6(Max)

PCB changed

48

Supplier Package

TSSOP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

48

Output Type

3-State

Polarity

Non-Inverting

Logic Function

Bus Transceiver

Output Level

TTL