54LS374/BSBJC

Freescale Semiconductor, Inc. (NXP Semiconductors) 54LS374/BSBJC

Part No:

54LS374/BSBJC

Datasheet:

-

Package:

-

AINNX NO:

32308892-54LS374/BSBJC

Description:

DFP, FL20,.3

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    20
  • Manufacturer Part Number
    54LS374/BSBJC
  • Rohs Code
    No
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    MOTOROLA SEMICONDUCTOR PRODUCTS
  • Package Description
    DFP, FL20,.3
  • Risk Rank
    5.92
  • Operating Temperature-Max
    125 °C
  • Operating Temperature-Min
    -55 °C
  • Package Body Material
    CERAMIC
  • Package Code
    DFP
  • Package Equivalence Code
    FL20,.3
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK
  • Supply Voltage-Nom (Vsup)
    5 V
  • Usage Level
    Military grade
  • JESD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    FLAT
  • Number of Functions
    8
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27 mm
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    R-XDFP-F20
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    MILITARY
  • Output Characteristics
    3-STATE
  • Logic IC Type
    D FLIP-FLOP
  • Screening Level
    38535Q/M;38534H;883B
  • Trigger Type
    POSITIVE EDGE
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