ECCN (US)
3A001.a.2.c
HTS
8542.39.00.01
Automotive
No
PPAP
No
Logic Family
ABT
Latch Mode
Transparent
Number of Channels per Chip
8
Number of Elements per Chip
1
Number of Inputs per Chip
8
Number of Input Enables per Element
1
Number of Selection Inputs per Element
0
Number of Outputs per Chip
8
Number of Output Enables per Element
1
Bus Hold
No
Set/Reset
No
Maximum Propagation Delay Time @ Maximum CL (ns)
Absolute Propagation Delay Time (ns)
7.7
Process Technology
BiCMOS
Maximum Low Level Output Current (mA)
48
Maximum High Level Output Current (mA)
-24
Minimum Operating Supply Voltage (V)
4.5
Typical Operating Supply Voltage (V)
5
Maximum Operating Supply Voltage (V)
5.5
Propagation Delay Test Condition (pF)
50
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
125
Supplier Temperature Grade
Military
Mounting
Through Hole
Package Height
3.3(Max)
Package Width
7.87(Max)
Package Length
26.92(Max)
PCB changed
20
Standard Package Name
DIP
Supplier Package
CDIP
Lead Shape
Through Hole
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Unconfirmed
Type
D-Type
Pin Count
a count of all of the component leads (or pins)
20
Output Type
3-State
Polarity
Non-Inverting