XPC860ENZP66C1

Freescale Semiconductor XPC860ENZP66C1

Part No:

XPC860ENZP66C1

Package:

-

AINNX NO:

69113954-XPC860ENZP66C1

Description:

Description: IC,COMMUNICATIONS CONTROLLER,BGA,357PIN

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    357
  • Rohs Code
    No
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    MOTOROLA SEMICONDUCTOR PRODUCTS
  • Package Description
    BGA, BGA357,19X19,50
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    BGA
  • Package Equivalence Code
    BGA357,19X19,50
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY
  • Supply Voltage-Nom
    3.3 V
  • JESD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27 mm
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    S-PBGA-B357
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    3.3 V
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