Freescale Semiconductor 1594/BEAJC

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Material

synthetic polyolefin

Number of Terminals

16

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP16,.3

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

15 V

Diameter of the protected wire (cable)

10.4…19.0 mm

Diameter before shrinkage

22.0 mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

coil 100 m

JESD-609 Code

e0

Type

Adhesive-free heat shrink tube

Terminal Finish

Tin/Lead (Sn/Pb)

Color

red

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Terminal Pitch

The center distance from one pole to the next.

2.54 mm

Reach Compliance Code

unknown

JESD-30 Code

R-XDIP-T16

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

+-15 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

MILITARY

Analog IC - Other Type

ANALOG MULTIPLIER OR DIVIDER

Supply Current-Max (Isup)

18 mA

Neg Supply Voltage-Nom (Vsup)

-15 V

Screening Level

38535Q/M;38534H;883B