FLEx FDMM032G-CAB

Package / Case

Axial

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

Axial

Number of Terminals

8

Package Style

UNCASED CHIP

Number of Words Code

32G

Package Body Material

UNSPECIFIED

Operating Temperature-Min

0

Operating Temperature-Max

70

Number of Words

34359738368

Package Code

DIE

Package Shape

RECTANGULAR

Package Description

CARD-8

Manufacturer Part Number

FDMM032G-CAB

Manufacturer

Flexxon Pte Ltd

Part Life Cycle Code

Contact Manufacturer

Ihs Manufacturer

FLEXXON GLOBAL LTD

Risk Rank

5.78

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 150°C

Series

RNX

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

0.140 Dia x 0.420 L (3.56mm x 10.67mm)

Tolerance

±10%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±200ppm/°C

Type

NOR TYPE

Resistance

4.7 kOhms

Composition

Metal Oxide Film

Power (Watts)

1W

Technology

CMOS

Terminal Position

UPPER

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Number of Functions

1

Reach Compliance Code

unknown

JESD-30 Code

R-XUUC-N8

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

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Supply Voltage-Max (Vsup)

3.6

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL

Supply Voltage-Min (Vsup)

2.7

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ASYNCHRONOUS

Organization

32GX8

Memory Width

8

Memory Density

2.7487790694e+11

Parallel/Serial

SERIAL

Memory IC Type

FLASH CARD

Programming Voltage

A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

2.7

Features

Flame Retardant Coating, High Voltage, Safety

Height Seated (Max)

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