FIBOX Enclosures AR864CHFSSL

Mounting Type

Through Hole

Material

Plastic, Polycarbonate

Mated Stacking Heights

10mm

Manufacturer

Fibox Enclosures

Product Status

Active

Mfr

FIBOX Enclosures

Base Product Number

AR864

Package

Box

Series

Free Height (FH)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

9.170 L x 7.060 W (232.92mm x 179.32mm)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Connector Type

Receptacle, Outer Shroud Contacts

Number of Positions

120

Color

Light Gray

Number of Rows

2

Pitch

0.050 (1.27mm)

Contact Finish

Gold

Design

Hinged Door, Lid

Container Type

Box

Area (L x W)

64.8in² (418cm²)

Features

--

Height

5.710 (145.03mm)

Contact Finish Thickness

--

Thickness

-

Height Above Board

0.295 (7.50mm)

Material Flammability Rating

-

Ratings

IP66, IP67, NEMA 4,4X,6,6P,12,13, UL 508