Ferroxcube TC6.3/3.8/2.5-3F3

Supplier Device Package

Toroid 6.3 x 3.8 x 2.5

Material

3E6

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

±25%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Finish

Parylene

Core Type

Toroid

Gap

Ungapped

Effective Area (Ae) mm2

3.06

Effective Length (le) mm

15.2

Effective Magnetic Volume (Ve) mm3

46.5

Initial Permeability (μi)

2000

Inductance Factor (Al)

500 nH

Diameter

0.248" (6.30mm)

Height

0.098" (2.50mm)