FCI 10038339001CLF

Mounting Type

BOARD

Shell Material

POLYETHYLENE

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

Ferrite

RoHS

Compliant

Package Description

LEAD FREE

Contact Finish Mating

NOT SPECIFIED

Insulator Material

POLYETHYLENE

Rohs Code

Yes

Manufacturer Part Number

10038339-001CLF

Mounting Styles

STRAIGHT

Contact Materials

NOT SPECIFIED

Manufacturer

Amphenol FCi

Part Life Cycle Code

Obsolete

Ihs Manufacturer

AMPHENOL FCI ASIA PTE LTD

Risk Rank

5.84

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel

Tolerance

10 %

Termination

SMD/SMT

Connector Type

TELECOM AND DATACOM CONNECTOR

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

POLARIZED

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Filter Feature

NO

Mixed Contacts

NO

Option

GENERAL PURPOSE

Total Number of Contacts

40

Depth

5.3 mm

Reach Compliance Code

compliant

Contact Gender

FEMALE

Empty Shell

NO

Body/Shell Style

RECEPTACLE

Inductance

22 µH

Termination Type

SURFACE MOUNT

DC Resistance (DCR)

210 mΩ

Max DC Current

1.11 A

Width

5.1 mm

Height

4.5 mm

Length

5.7 mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No