SX-ULPGN-2000-SP
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35685712-SX-ULPGN-2000-SP
WiFi Development Tools - 802.11 The SX-ULPGN US Version (sample pack) is an ultra-low-power hostless Wi-Fi IoT module with 802.11 b/g/n support. Surface mount based on QCA4010.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.