All Products
Extech AP-500AC-US
Part No:
AP-500AC-US
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
35685702-AP-500AC-US
Category:
Description:
WiFi Modules - 802.11 AP-500AC 802.11a/b/g/n/ac Access Point with Enhanced Roaming, Enterprise Security, and PoE, US Power Supply
Products specifications
- Factory Pack QuantityFactory Pack Quantity1
- ManufacturerSilex Technology
- BrandSilex Technology
- RoHSDetails
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Bulk - SubcategoryWireless & RF Modules
- Output Power
That power available at a specified output of a device under specified conditions of operation.
- - Product Type
a group of products which fulfill a similar need for a market segment or market as a whole.
WiFi Modules - Product Category
a particular group of related products.
WiFi Modules - 802.11
0 Similar Products Remaining
Hot Sale
SX-59HLS
ExtechWiFi Modules - 802.11 Dual 802.11 a/b/g/n ultra-low-power BULKSX-ULPGN-BTZ-2000
ExtechWiFi Modules - 802.11 2.4/5 GHz 72Mbps 3.3V/1.8VSX-SDMAC-2830S R2 SP
ExtechWiFi Modules - 802.11 Wi-Fi+BLE Mod SM w/Ant uFl con SamPckSX-590-2700-SP-WWR
ExtechWiFi Modules - 802.11 802.11ac Systeom on Mod for WLANSSX-ULPGN-DB-2000
ExtechWiFi Modules - 802.11 Hostless 802.11a/b/g/n Dual Band WI-Fi IoT platformSX-PCEAC2-SMT
ExtechMultiprotocol Modules 2x2 Dual Band 802.11 ac WLAN+BT SMTSX-ULPAN-2404-SP
ExtechWiFi Modules - 802.11 802.11n Wi-Fi Module Sample PackagingSX-PCEGN-BBNL+
ExtechWiFi Modules - 802.11 802.11b/g/n, 2.4GHz single bnd, 2x2 MIMOSX-ULPAN-2401
ExtechWiFi Modules - 802.11 Ultra-low-power dual band 802.11 a/b/g/nSX-ULPAN-2401-SP
ExtechWiFi Modules - 802.11 Ultra-low-power dual band 802.11 a/b/g/n