MR25H256CDF

Everspin Technologies Inc. MR25H256CDF

Part No:

MR25H256CDF

Datasheet:

MR25H256(A)

Package:

8-VDFN Exposed Pad

ROHS:

AINNX NO:

1702307-MR25H256CDF

Category:

Memory

Description:

NVRAM 256Kb 3.3V 32Kx8 Serial MRAM

Products specifications
  • Factory Lead Time
    14 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    8-VDFN Exposed Pad
  • Number of Pins
    8
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Published
    2013
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    600mW
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27mm
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Interface
    SPI, Serial
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256Kb 32K x 8
  • Nominal Supply Current

    Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.

    27mA
  • Clock Frequency
    40MHz
  • Access Time
    10 ns
  • Memory Format
    RAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SPI
  • Data Bus Width
    8b
  • Memory Width
    8
  • Density
    256 kb
  • Word Size

    Word "size" refers to the amount of data a CPU's internal data registers can hold and process at one time.

    8b
  • Length
    6mm
  • Height Seated (Max)
    0.9mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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