Everlight Electronics T315SURWA/S530-A3

RoHS

Details

Mounting Styles

Through Hole

Factory Pack QuantityFactory Pack Quantity

22

Touch Panel

Without Touch Panel

Character Displayed

Numeric

Viewing Area Height (mm)

9.2(mm)

Operating Temperature Classification

Industrial

Package Type

DIP MODULE

Emitting Color

Hyper Red

Product Depth (mm)

14.1(mm)

Dominant Wave Length

624(nm)

Maximum Forward Current

25(mA)

Reverse Current

100(uA)

Number of Elements

24

Digit Size (in)

0.36(in)

Rad Hardened

No

Viewing Area Length (mm)

4.8(mm)

Test Current (It)

10(mA)

Total Thickness

7.2(mm)

Mounting

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Type

Panel

Pin Count

a count of all of the component leads (or pins)

12

Configuration

Common Cathode

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

60(W)

Forward Voltage

the amount of voltage needed to get current to flow across a diode.

2.4(V)

Luminous Intensity

In photometry, luminous intensity is a measure of the wavelength-weighted power emitted by a light source in a particular direction per unit solid angle, based on the luminosity function, a standardized model of the sensitivity of the human eye.

12500ucd

Reverse Voltage

the voltage drop across the diode if the voltage at the cathode is more positive than the voltage at the anode

5(V)

Peak Wavelength

632(nm)

Product Length (mm)

22.6(mm)

Product Height (mm)

7.2(mm)