Essentra Components MWS1-1-01

Factory Lead Time

3 Weeks

Mount

Push In, Rivet

Mounting Type

Push In

Material

Polyamide (PA66), Nylon 6/6

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Richco

Published

2004

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Type

Clip, Wire Saddle

Color

Natural

Type Attributes

Micro

Opening Size

0.170L x 0.120 H 4.32mmx3.05mm

Panel Hole Size

0.070 1.78mm

Diameter

4.3mm

Height

0.230 5.84mm

Length

0.270 6.86mm

Width

0.075 1.91mm

Thickness

1.6mm

Panel Thickness

0.093 2.36mm

Material Flammability Rating

UL94 V-2

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Flammability Rating

UL94 V-2

Lead Free

Lead Free