ERNI Electronics 254168

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8536.69.40.30

Automotive

No

PPAP

No

Termination Method

Solder

Terminal Pitch (mm)

0.8

Body Orientation

Straight

Maximum Operating Temperature (°C)

125

Mating Cycle (Cycles)

10

Product Depth (mm)

4.1

Mounting

Surface Mount

Number of Contact Rows

1

Mounting Styles

Surface Mount

Pitch (mm)

0.8(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Backplane

Gender

M/F

Number of Contacts

12

Product Length (mm)

11.96

Product Height (mm)

3.9