Epson Electronics America Inc-Semiconductor Div S1D13A04F00A100

Factory Lead Time

20 Weeks

Mounting Type

Surface Mount

Package / Case

128-TQFP

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Published

1994

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

128

ECCN Code

EAR99

Type

Graphic Controller

Applications

LCD Display

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ALSO OPERATES AT 2.5V SUPPLY

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Supply Voltage

2V

Terminal Pitch

The center distance from one pole to the next.

0.4mm

Pin Count

a count of all of the component leads (or pins)

128

JESD-30 Code

S-PQFP-G128

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Supply Voltage-Max (Vsup)

2.2V

Supply Voltage-Min (Vsup)

1.8V

Bus Compatibility

SH-3; SH-4; 68000; 68030; 68EZ328; 68VZ328; USB

Display Configuration

320 X 320 PIXELS

Length

14mm

Height Seated (Max)

1.2mm

Width

14mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant