EPCOS (TDK) SESUB-PAN-D14580 SAMPLE

EU RoHS

Compliant

Automotive

No

PPAP

No

Protocols Supported

Bluetooth v4.1 (BLE)

Processing Unit Type

Microprocessor

Maximum Operating Frequency (MHz)

2400(Typ)

Typical Sensitivity (dBm)

94

Interface Type

I2C/SPI/UART

Antenna Mounting

External

Mounting

Surface Mount

Package Width

3.5

Package Length

3.5

PCB changed

36

Supplier Package

BGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Module

Pin Count

a count of all of the component leads (or pins)

36