Fail Safe (Short-circuit Spring)
No
DC Powerline
No
AC Powerline class I
No
AC Powerline class II
No
AC Powerline class III
No
Follow Current Capability
No
Temporary Over Voltage Capability
No
UL Certificate UL497B
E163070
Mounting Method
Leaded Mount
Soldering Method
Wave Soldering
Climate Category [IEC 600068-1]
40/125/21
Length (Nom.) / mm
6
Height (Max.) / mm
5.7
Width or Diameter
5.50mm Nom.
Width or Diameter (Nom.) / mm
5.5mm
Capacitance [1MHz] / F
1pF
DC Sparkover Voltage (Nom.) / V
350V
Insulation Resistance (Min.) / Ω
1000M Ohms
Service Life: 1 operation 50Hz, 0.18s [9 cycles] / A
5
Service Life: 1 operation [8/20μs] / A
5000
Service Life: 1 operation [10/350μs] / A
500
Nominal Alternating Discharge Current / A
2.5A
Nominal Impulse Discharge Current / A
2500A
Glow Voltage / V
60
Glow to Arc Transition Current / A
<0.3
Arc Voltage [1A] / V
10
Impulse Sparkover Voltage (Max.) [1kV/μs] / V
900
Impulse Sparkover Voltage (Max.) [100V/μs] / V
800
Weight / g
1
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Axial Taping Strip
Tolerance
±20%
Type
EM350X
Applications
General
Length
6.00mmNom.
Height
5.70mm Max.