EPC2103

EPC EPC2103

Part No:

EPC2103

Manufacturer:

EPC

Datasheet:

EPC2103

Package:

Die

ROHS:

AINNX NO:

6377199-EPC2103

Description:

TRANS GAN SYMMETRICAL HALF BRIDG

Products specifications
  • Factory Lead Time
    14 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    Die
  • Supplier Device Package
    Die
  • Current - Continuous Drain (Id) @ 25℃
    28A
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~150°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    eGaN®
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • FET Type
    2 N-Channel (Half Bridge)
  • Rds On (Max) @ Id, Vgs
    5.5mOhm @ 20A, 5V
  • Vgs(th) (Max) @ Id
    2.5V @ 7mA
  • Input Capacitance (Ciss) (Max) @ Vds
    760pF @ 40V
  • Gate Charge (Qg) (Max) @ Vgs
    6.5nC @ 5V
  • Drain to Source Voltage (Vdss)
    80V
  • FET Feature
    GaNFET (Gallium Nitride)
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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