EPC2051ENGRT

EPC EPC2051ENGRT

Part No:

EPC2051ENGRT

Manufacturer:

EPC

Datasheet:

-

Package:

Die

AINNX NO:

35188138-EPC2051ENGRT

Description:

TRANS GAN 100V DIE CU PILLAR

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    Die
  • Supplier Device Package
    Die
  • Current - Continuous Drain (Id) @ 25℃
    1.7A
  • Drive Voltage (Max Rds On, Min Rds On)
    5V
  • Power Dissipation (Max)
    --
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 150°C (TJ)
  • Series
    eGaN®
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Technology
    GaNFET (Gallium Nitride)
  • FET Type
    N-Channel
  • Rds On (Max) @ Id, Vgs
    25 mOhm @ 3A, 5V
  • Vgs(th) (Max) @ Id
    2.5V @ 1.5mA
  • Input Capacitance (Ciss) (Max) @ Vds
    280pF @ 50V
  • Gate Charge (Qg) (Max) @ Vgs
    2.3nC @ 5V
  • Drain to Source Voltage (Vdss)
    100V
  • Vgs (Max)
    +6V, -4V
  • FET Feature
    --
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