EPC B37871K5222F60

Package / Case

1206

Number of Terminals

2

EU RoHS

Compliant with Exemption

ECCN (US)

EAR99

Automotive

Yes

PPAP

Unknown

Capacitance Value

0.0022uF

Microwave Application

No

Mounting

Surface Mount

Case Style

Ceramic Chip

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Product Depth (mm)

1.6

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Tolerance

1%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Construction

Flat

Termination Style

Pad

Dielectric

C0G

Voltage

50VDC

Size(mm)

3.2 X 1.6 X 0.8

Product Length (mm)

3.2

Product Height (mm)

0.8