B32676F1106K000

EPC B32676F1106K000

Part No:

B32676F1106K000

Manufacturer:

EPC

Datasheet:

-

Package:

-

AINNX NO:

31823643-B32676F1106K000

Description:

Products specifications
  • Seated Plane Height (mm)
    45(Max)
  • Lead Diameter (mm)
    1.2
  • Product Depth (mm)
    30(Max)
  • Maximum Operating Temperature (°C)
    100
  • Minimum Operating Temperature (°C)
    -40
  • Terminal Pitch (mm)
    37.5
  • Mounting
    Through Hole
  • Capacitance Value
    10uF
  • PPAP
    No
  • Automotive
    No
  • ECCN (US)
    EAR99
  • EU RoHS
    Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Tolerance
    10%
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Unconfirmed
  • Termination Style
    Radial
  • Dielectric
    PP
  • Voltage
    375VAC|750VDC
  • Size(mm)
    42 X 30 X 45
  • Product Length (mm)
    42(Max)
  • Product Height (mm)
    45(Max)
0 Similar Products Remaining