EMBP01-F171-H3100

EM Microelectronic EMBP01-F171-H3100

Part No:

EMBP01-F171-H3100

Manufacturer:

EM Microelectronic

Datasheet:

EMBP01-DS.pdf

Package:

-

AINNX NO:

69794015-EMBP01-F171-H3100

Description:

RF TXRX MODULE BT CHAS MNT

Products specifications
  • Base Product Number
    EMBP01
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Applications
    Bluetooth
  • Voltage - Supply
    2.3V ~ 3.6V
  • Frequency
    2.4GHz
  • Function
    Bluetooth BLE iBeacon
  • Power - Output
    6dBm
  • Modulation or Protocol

    Modulation is the process of converting data into radio waves by adding information to an electronic or optical carrier signal. A carrier signal is one with a steady waveform -- constant height, or amplitude, and frequency.

    Bluetooth v5.0, Low Energy (BLE)
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