Emerson MP8-3W-2E-4NN-00

Shell Material

Steel

Unit Weight

1 oz

Factory Pack QuantityFactory Pack Quantity

1

Manufacturer

TE Connectivity

Brand

TE Connectivity / AMP

Tradename

AMPLIMITE

RoHS

Details

Filtered

Unfiltered

Insulation Materials

Thermoplastic

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Number of Positions

62 Position

Number of Rows

3 Row

Gender

Male

Subcategory

D-Sub Connectors

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

High Density D-Sub Connectors

Shell Plating

the outer-most structure on the hull of a steel or aluminum ship or boat.

Tin

Product Category

a particular group of related products.

D-Sub High Density Connectors