Eaton - Bussmann Electrical Division SFC-FUSE-CAB

Factory Lead Time

5 Weeks

Material

Metal, Steel

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

24.000Lx12.000W 609.60mmx304.80mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Color

Gray

Design

Hinged Door

Container Type

Cabinet

Area (L x W)

288in2 (1858cm2)

Height

30.000 762.00mm