Eaton - Bussmann Electrical Division DS2-5-03P

For Use With/Related Products

DG, DP and DDNS Series

Contact Materials

Copper Alloy

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Terminal Block, Cross Connection

Number of Positions

3

Color

Gray

Pitch

0.201" (5.10mm)

Style

Screw - Half Thread

Contact Finish

Tin