Eaton 467

Mounting Type

Fastener

Material

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Bundle Center to Mounting Center

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Lead Free Status / RoHS Status

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Series

Fairlead

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

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Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

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Type

Clamp, Bundle Separation

Color

Gray, Purple

Adhesive

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Screw Size

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Type Attributes

Multiple Openings

Opening Size

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Panel Hole Size

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Features

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Width

0.880 (22.35mm)

Height

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Length

3.260 (82.80mm)

Panel Thickness

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Material Thickness

A measure of the distance between two surfaces of an object

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Material Flammability Rating

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