E2V 5962-8950602LA(IDT)

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Lead, Tin

Mount

Through Hole

RoHS

Compliant

Schedule B

8542390000

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

0.01 %

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

2 ppm/°C

Resistance

100 Ω

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150 °C

Min Operating Temperature

-55 °C

Composition

Metal Foil

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

10 W

Features

Moisture Resistant

Width

25.4 mm

Height

8.509 mm

Length

38.862 mm