Diotec Semiconductor BAS70-04W-AQ

Mounting Type

Surface Mount

Package / Case

SC-70, SOT-323

Supplier Device Package

SOT-323

Current - Average Rectified (Io) (per Diode)

70mA

Qualification

AEC-Q101

Base Product Number

BAS70

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Small Signal =< 200mA (Io), Any Speed

Current - Reverse Leakage @ Vr

100 nA @ 50 V

Voltage - Forward (Vf) (Max) @ If

1 V @ 15 mA

Operating Temperature - Junction

-55°C ~ 150°C

Voltage - DC Reverse (Vr) (Max)

70 V

Diode Configuration

1 Pair Series Connection

Reverse Recovery Time (trr)

5 ns

Grade

Automotive